CAPABILITIES

What We Do


Board types Rigid, HDI, Flex, Rigid-flex, Metal core
Materials FR4, High Tg FR4, Polyimide, Arlon, Teflon, Rogers, Metal Core
Layers 2-60
Copper Weight 1/3oz - 6oz
Lamination Cycles 4+
Drilling Microvias, Blind and Buried vias, Stacked vias, Back drilling
Routing/ V-score Mechanical, Laser
Soldermask LPI, multiple colors
Via fill Conductive, Non-conductive and Solid Copper
Surface finish HASL, Lead Free HAL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Hard Gold Body, Soft Bondable Gold, OSP

What We Offer


Customer service
  • Domestic Technical Support
  • Timely response to all quotes
  • Prompt communication with inventory and status reports
  • 100% inspection on all products
Competitive Lead Times
  • 1-10 day turn on proto and small production
  • 2-4 week turn on all start-up production orders
  • 2-3 week turn on repeat orders
Stocking Programs
  • Programs to minimize inventory costs
  • Ship to your schedule, EDI pulls or manual releases
  • Warehouse in Northern California

Printed Circuit Board Capabilities

Board Dimensions:

  • Maximum Board Size of 20 x 27"
  • Minimum Board Size of 0.2 x 0.2"
  • Maximum Board Thickness of 0.25"
  • Minimum Board Thickness of 0.007"

Inner Layers:

  • Minimum Trace Space of 0.003" / 0.003"
  • Minimum Copper Thickness of 1/3oz
  • Minimum Core Thickness of 0.002
  • Maximum Copper Thickness 6oz

Lamination:

  • Maximum Layers = 60
  • Sequential Lamination = 4+N+4
  • Layer to Layer Registration +/- 0.005

Drilling:

  • Minimum Mechanical Drill Size = 0.006
  • Mechanical True Position Tolerance = +/- 0.003
  • Laser Minimum Size = 0.0025
  • Laser Maximum Size = 0.006

Outer Layers:

  • Minimum trace / space 0.003 / 0.003
  • Max Copper Thickness = 6oz
  • Line Tolerance = 10%

Plating:

  • Max Aspect Ratio of 30:1
  • Cu Thickness in through hole of 0.001-0.0015"
  • Plated Hole Tolerance +/- 0.003
  • NPTH Tolerance +/- 0.002

Soldermask - LPI:

  • Mask Thickness 0.0004
  • Solder Dam width = 0.004
  • Mask Registration Tolerance 0.002
  • Silkscreen Stroke Width 0.006

HDI:

  • BGA pitch 0.3mm
  • Minimum BGA pad / space = 0.008 / 0.004
  • Laser Drill Maximum Dielectric Thickness 0.005"
  • Laser Drill Via size = 0.0025 (min) / 0.006 (max)
  • Laser Drill Minimum Dielectric Thickness .0015

Impedance Control

  • Impedance Tolerance +/-10%